To provide a manufacturing method for a multi-layer wiring board of high productivity which can manufacture metal wiring of high accuracy and high adhesion and can manufacture a multi-layer wiring board of excellent veer connection reliability for high yield.
A manufacturing method for a multi-layer wiring board comprises: (A) a process for forming an insulation layer on the surface of a wiring board comprising metal wiring; (B) a process for forming a veer hole; (C) a process for performing a desmear process; (D) a process for obtaining a laminated body by laminating on the insulation layer a laminated film for resin layer formation comprising a temporary support body, a function group which forms interaction with a plating catalyst or a precursor on the temporary support body, and a resin layer including a polymer containing a polymerizable group, so that the resin layer and the insulation layer which has the desmear process done contact each other; (E) a process for peeling the temporary support body from the laminated body; (F) a process for attaching the plating catalyst and the precursor on the wall of the veer hole and the resin layer to perform plating.
| JPH06148877A | 1994-05-27 | |||
| JP2010157590A | 2010-07-15 | |||
| JP2001308536A | 2001-11-02 | |||
| JPH06148877A | 1994-05-27 | |||
| JP2010157590A | 2010-07-15 | |||
| JP2001308536A | 2001-11-02 |
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi