MANUFACTURING METHOD FOR MULTILAYER BODY AND MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE

Japanese Patent JP2022141261

A

To provide a manufacturing method for a multilayer body and a manufacturing method for a semiconductor substrate, in which a semiconductor substrate with a bump and a supporting substrate are temporarily attached to each other so that the substrates are separable, and the bump deformation by a load from the outside, such as heating, is suppressed or relieved.SOLUTION: A multilayer body includes a semiconductor substrate 1 with a bump 1a, a supporting substrate 4, a first adhesive layer 2 formed in contact with the semiconductor substrate with the bump, and a second adhesive layer 3 formed between the first adhesive layer and the supporting substrate. A step of forming the first adhesive layer includes: a first adhesive application layer forming step of forming a first adhesive application layer by applying on the semiconductor substrate with the bump, a first adhesive composition containing a thermosetting adhesive component with a curing start temperature Tc and a thermal expansion particle with an expansion start temperature Ts; and a first adhesive layer forming step of forming the first adhesive layer by heating the first adhesive application layer at a temperature Tf to cure the thermosetting adhesive component. Ts, Tc, and Tf satisfy Ts≤Tc≤Tf.SELECTED DRAWING: Figure 1

OKUNO TAKAHISA
USUI YUKI
FUKUDA TAKUYA
YANAI MASAKI
YAGYU MASAFUMI
SHINJO TETSUYA

JP2021041483A

September 29, 2022

March 15, 2021

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NISSAN CHEMICAL CORP

B05D3/02; H01L21/02; B05D5/00; B05D7/00; B05D7/24; B32B5/20; B32B7/025; B32B7/06; B32B27/00; B32B27/18; C09J7/30; C09J11/08; C09J183/04; C09J201/00; H01L21/304

Ryoichi Takaoka
Nao Oda
Takeshi Yamashita
Sachiko Komori
Yoshihiro Higuchi

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