Title:
MANUFACTURING METHOD OF MULTILAYER CERAMIC ELECTRONIC COMPONENT, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2023146779
Kind Code:
A
Abstract:
To provide a manufacturing method of a multilayer ceramic electronic component capable of suppressing fusion of an external electrode, the multilayer ceramic electronic component, and a circuit board.SOLUTION: A manufacturing method of a multilayer ceramic electronic component includes: a step of preparing an element assembly including a first end face which includes a plurality of dielectric layers and a plurality of internal electrode layers laminated via the plurality of dielectric layers and in which ends of partial internal electrode layers in the plurality of internal electrode layers are exposed, and a second end face in which ends of the other partial internal electrode layers in the plurality of internal electrode layers are exposed and which is opposed with the first end face; a first external electrode forming step of seizing and forming a first external electrode on the first end face; and a second external electrode forming step is seizing and forming a second external electrode, of which the composition is different from that of the first external electrode, on the second end face at a temperature lower than that in the first external electrode forming step by 50°C or more.SELECTED DRAWING: Figure 6
More Like This:
| JPS6466916 | MANUFACTURE OF LAMINATED CERAMIC CAPACITOR |
| WO/2023/233836 | MULTILAYER CERAMIC CAPACITOR |
| JP4244616 | How to process ceramic green sheet |
Inventors:
KANEDA KAZUMI
NAKAMURA TOMOAKI
NAKAMURA TOMOAKI
Application Number:
JP2022054153A
Publication Date:
October 12, 2023
Filing Date:
March 29, 2022
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/30; H01G2/06
Attorney, Agent or Firm:
Shuhei Katayama
Previous Patent: UV irradiation device
Next Patent: Connection device, charging amount adjustment system, and charging amount adjustment method
Next Patent: Connection device, charging amount adjustment system, and charging amount adjustment method