Title:
多層セラミック基板の製造方法
Document Type and Number:
Japanese Patent JP5077418
Kind Code:
B2
Abstract:
An electrically conductive paste used for forming wiring conductors, such as via holes (15) disposed on a multilayer ceramic substrate (11), is provided, wherein the temperature range, in which sintering is effected in a firing step, can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a grass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (12) included in the multilayer ceramic substrate (11) in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150?C to 300?C lower than the above-described sintering temperature.
Inventors:
Masato Nomiya
Urakawa Jun
Urakawa Jun
Application Number:
JP2010246193A
Publication Date:
November 21, 2012
Filing Date:
November 02, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/46; H01B1/16; H01L23/498; H05K1/09; H05K3/40
Domestic Patent References:
| JP200381683A | ||||
| JP2002298651A | ||||
| JP2002198626A | ||||
| JP10215046A | ||||
| JP2003179320A |
Attorney, Agent or Firm:
Masaaki Koshiba