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Patent Searching and Data


Title:
MANUFACTURING METHOD OF OPTICAL CIRCUIT BOARD WITH ADHESIVE LAYER, AND OPTICAL CIRCUIT BOARD WITH ADHESIVE LAYER
Document Type and Number:
Japanese Patent JP2008122908
Kind Code:
A
Abstract:

To provide a manufacturing method of an optical circuit board with an adhesive layer which has superior productivity, and the optical circuit board with the adhesive layer.

The manufacturing method of the optical circuit board with the adhesive layer includes a first stage of bonding a sheet type adhesive, having a pressure-sensitive adhesive layer and an adhesive layer formed in this order on a support base material, and the optical circuit board together, a second stage of dividing the optical circuit board into pieces, and a third stage of decreasing the contact force of the interface between the pressure-sensitive adhesive layer and support base material to peel the pressure-adhesive layer off along the interface.


Inventors:
SHIBATA TOMOAKI
MASUDA HIROSHI
TAKAHASHI ATSUSHI
Application Number:
JP2007119530A
Publication Date:
May 29, 2008
Filing Date:
April 27, 2007
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G02B6/13; G02B6/122
Attorney, Agent or Firm:
Tamotsu Otani
Masamichi Tohei
Masahiro Tsukawaki
Makoto Kataoka
Kenichi Hirasawa