Title:
光印刷回路基板の製造方法
Document Type and Number:
Japanese Patent JP4714195
Kind Code:
B2
Abstract:
An optical printed circuit board which can transfer optical signal and electric signals simultaneously, and a method of fabricating the optical printed circuit board. An optical printed circuit board which includes an upper cladding layer, a core layer positioned in the upper cladding layer that has a first reflecting surface and a second reflecting surface at both ends to guide optical signals, a lower cladding layer of which one side is in contact with the upper cladding layer and which has a circuit pattern and light connecting bumps on the other side corresponding to the first reflecting surface and the second reflecting surface, may provide the advantage of high optical connection efficiency.
Inventors:
Kim Shunsei
Yanagitsu Yanagi
Cao Han Rui
Money
Yanagitsu Yanagi
Cao Han Rui
Money
Application Number:
JP2007211029A
Publication Date:
June 29, 2011
Filing Date:
August 13, 2007
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
G02B6/13; G02B6/122; G02B6/42; H05K1/02
Domestic Patent References:
| JP2006030798A | ||||
| JP2006162850A | ||||
| JP2001166167A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Yuko Hara
Masakazu Ito
Yuko Hara