Title:
MANUFACTURING METHOD OF PAPER WITH IC TAG INLET EMBEDDED
Document Type and Number:
Japanese Patent JP2008077155
Kind Code:
A
Abstract:
To provide an application method that can operationally stably apply adhesive as means for improving adhesion of non-contact IC tag inlets and paper layers when the IC tag inlets are embedded between the paper layers in a papermaking process.
A manufacturing method of paper with IC tag inlets embedded which places non-contact IC tag inlets on a surface of wet paper A formed on a screen a and laminates it with wet paper B formed on another screen sprays adhesive on the surface of the wet paper A before placing the IC tag inlets. The adhesive may further be sprayed on the IC tag inlets after the IC tag inlets are placed on the surface of the wet paper A.
Inventors:
OGAWA HIDENORI
SUZUKI ATSUSHI
KATO MASATSUGU
SUZUKI ATSUSHI
KATO MASATSUGU
Application Number:
JP2006252464A
Publication Date:
April 03, 2008
Filing Date:
September 19, 2006
Export Citation:
Assignee:
JUJO PAPER CO LTD
International Classes:
G06K19/077; D21F11/04; D21F11/08; D21H21/48; D21H27/00; G06K19/07
Attorney, Agent or Firm:
Kazuo Kawasumi
Junko Oda
Junko Oda
Previous Patent: VEHICLE PERIPHERY SUPERVISION UNIT
Next Patent: COMMUNICATION METHOD FOR PEER-TO-PEER NETWORK
Next Patent: COMMUNICATION METHOD FOR PEER-TO-PEER NETWORK