To provide a paste impartion apparatus capable of suppressing the thickness at ends in the width direction of a paste pattern from being made thiner than the thickness at a center part and suppressing the thickness at the center part from being thick excessively when paste is imparted to an electronic component, and to provide a method for manufacturing the electronic component.
A slit 1 through which paste passes is arranged at a predetermined position, and paste is imparted on a surface of an electronic component 38 via the slit 1 by using a slit plate 2 having a non-penetration area along the longitudinal direction of the slit 1 substantially at a center of the width direction of the slit 1 so that a predetermined spacing is ensured from a surface with paste imparted thereon. In addition, the width W of the non-penetration area satisfies the requirement of W ≤ ä(Ws-W)/2} in the relationship to the width Ws of the slit.
COPYRIGHT: (C)2005,JPO&NCIPI
Masaaki Taniguchi
Yoshio Kawaguchi
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