To provide a polishing machine for acquiring a uniform and highly precise flat surface and a manufacturing method for a high quality polishing thin plate.
The polishing machine is characterized in: being equipped with an upper surface plate 31 having an upper surface plate hollow part 49 opening toward the bottom surface, a lower surface plate 23 having a lower surface plate hollow part 27 formed opening toward the upper surface, a polishing pad 25 provided at the opening part of either the upper surface plate 31 or the lower surface plate 23, and a sheet-like holding material 47 at the opening of the hollow part of the other surface plate; having a polishing material W arranged between the holding material 47 and the polishing pad 25; floatingly supporting the polishing pad 25 and the polishing material W by supplying pressurized fluid to the inside of each of the hollow parts 49, 27 to elastically stretch the polishing pad 25 and the polishing material W; and supplying slurry to the polishing pad 25 and relatively moving the polishing pad 25 and the polishing material W to polish the polishing material W.
| WO/2024/074631 | PLATE GRINDING/POLISHING DEVICE |
| JP2935843 | [Title of Invention] Wrapping Carrier |
Tadashi Takahashi
Masakazu Aoyama
Akihiko Eguchi
Hideyuki Sugiura
Yasuhiko Murayama
Noriko Yanai