To provide a manufacturing method of a printed wiring board which accurately forms via holes.

A manufacturing method of a printed wiring board having via holes includes: a first process S11 to S13 where a first imprint mold having first protruding parts is pressed against a first main surface of a resin film to form recessed parts on a resin film; a second process S21 to S23 where a second imprint mold having second protruding parts is pressed against a second main surface 2 of the resin film to cause the second protruding parts to penetrate to the recessed parts thereby forming through holes on the resin film; and a third process S30 to S50 where the through holes are filled with a conductor to form via holes.