Title:
プリント配線板の製造方法及びプリント配線板
Document Type and Number:
Japanese Patent JP4391991
Kind Code:
B2
Abstract:
To provide a printed wiring board having a through hole conductor, which can be manufactured using either the additive method or the subtractive method. [Constitution] A printed wiring board 100 according to the present invention has a through hole conductor 6 formed on the surface of a through hole 5 formed in a 1, and on the surface of the 1 in the vicinity of an opening of the through hole 5. The through hole conductor 6 is filled with a positive photosensitive resin 7. A capped conductor (plating) 8 is formed on the positive photosensitive resin 7 and the through hole conductor 6. Further, a circuit pattern 14 is formed on the surface of the 1. An insulating layer 3 is formed on the surface of the 1, capped conductor (plating) 8, and the circuit pattern 14, and formed with a via hole 16 extending from the surface of the insulating layer 3 to capped conductor (plating) 8. A via conductor 10 is formed inside the via hole 16 and on the surface of the insulating layer 3 in the vicinity of an opening of the via hole 16.
Inventors:
Koichi Osumi
Kaoru Kobayashi
Kaoru Kobayashi
Application Number:
JP2005513424A
Publication Date:
December 24, 2009
Filing Date:
August 19, 2004
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H05K3/46; H05K3/00; H05K3/28; H05K3/42; H05K3/10
Domestic Patent References:
| JP6275959A | ||||
| JP6302963A | ||||
| JP9312459A | ||||
| JP1168297A |
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi