To solve a problem wherein the angular shift between respective quartz wafers, caused when the quartz wafers are laminated, becomes about ± several degrees and the difference in the temperature characteristics of the quartz substrate cut from a quartz wafer block is produced between the respective quartz wafers.

In the manufacturing method of the quartz substrate for forming a plurality of the quartz substrates from the quartz wafer by dicing processing, a process, wherein the quartz wafer is irradiated with light or X-rays before or after a process for pasting up a dicing tape on the quartz wafer to detect a crystal axis direction to correct the axial direction position of the quartz wafer with respect to the running direction of a dicing blade to a proper value, is provided.