To obtain the manufacturing method of a resin laminate, in which recessed pa and penetrated parts for forming a minute hollow structure such as a micro-flow path or the like can be highly accurately and easily formed and which necessitates no valuable device such as a plasma device or the like.
In the manufacturing method of the resin laminate, a curable composition including a first resin, which cures when a first trigger is given, and a second resin, which cures when a second trigger is given, is coated on the top surface of a patterning material so as to semi-cure the curable composition through curing the first resin in the curable composition by giving the first trigger in order to transfer its reversed shape to the projected part of the patterning material. By giving the second trigger under the condition that the obtained semi-cured composition member is seated on the top surface of a board, the semi-cured composition member is cured, resulting in bonding a resin sheet comprising the cured matter of the semi-cured composition to the board and, at the same time, in forming a hollow part A between the board and the resin sheet.
AKAGI YOSHINORI
YAMAMOTO KAZUYOSHI
FUKUI KOJI
| JP2000288381A | 2000-10-17 | |||
| JP2002207027A | 2002-07-26 | |||
| JPH1039120A | 1998-02-13 | |||
| JP2000288381A | 2000-10-17 |
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