Title:
樹脂封止型電子部品の製造方法および樹脂封止型電子部品
Document Type and Number:
Japanese Patent JP4809717
Kind Code:
B2
Inventors:
Kazumi Sawasaki
Hidetoshi Oya
Hidetoshi Oya
Application Number:
JP2006155480A
Publication Date:
November 09, 2011
Filing Date:
June 03, 2006
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
B29C45/14; B29C33/12; B29C39/10; B29C45/26
Domestic Patent References:
| JP2004134257A | ||||
| JP2004111435A | ||||
| JP2005142215A | ||||
| JP8148642A | ||||
| JP6224314A | ||||
| JP2004127571A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu