To provide a technology capable of enhancing the production yield of a resin-sealed semiconductor device.
The method of manufacturing a resin-sealed semiconductor device to be provided is to form a die pad such that the area of the main surface on which a semiconductor chip is mounted is smaller than the area of the semiconductor chip and to seal the semiconductor chip and the die pad into a resin-sealed body. The semiconductor chip and the die pad are arranged in a cavity of a metal mold such that the gap between the rear face of the die pad and the inner wall face, which faces the former, of the cavity is narrower than the gap between the main surface of the semiconductor chip and the inner wall face, which faces the former, of the cavity by the thickness of the die pad. Since the resin is injected from a center gate simultaneously into the upper and the lower sides of the cavity to form the resin-sealed body, there is no possibility that the semiconductor chip is pushed upward by the resin filled in the filling region in the rear side of the semiconductor chip. As a result, the failure that the semiconductor chip, bonding wires, and the like are exposed outside the resin-sealed body is prevented, and the yield of the resin-sealed semiconductor device can be enhanced.
COPYRIGHT: (C)2004,JPO
Suzuki Hiromichi
Kazushige Suzuki
Takafumi Nishida
Fujio Ito
Kunihiro Tsubosaki
Akihiko Kameoka
Kunihiko Nishi
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| JP63199619A | ||||
| JP2186647A |