Title:
MANUFACTURING METHOD OF SEALED CONTACT-POINT DEVICE
Document Type and Number:
Japanese Patent JP3873597
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sealed contact-point device which is related to a manufacturing technology for the sealed contact-point device, for reduced processes and work cost and moreover is superior in airtightness.
SOLUTION: A method for manufacturing a sealed contact-point device is provided, where a contact-point 100 is provided in the inside space which is formed when a metal base 10 is jointed to a metal cap 20, with the inside space around the contact-point 100 being filled with a hydrogen mixed gas. There are provided a process (a) where the metal cap 20 and the metal base 10 are arranged in a chamber 30, a process (b) where the chamber 30 is filled with the hydrogen mixed gas atmosphere, and a process (c) where joint parts 22 and 14 of the metal cap 20 and the metal base 10 are welded in hydrogen-mixed gas atmosphere.
Inventors:
Yoshiharu Sanagawa
Shinobu Kida
Shinobu Kida
Application Number:
JP2000258003A
Publication Date:
January 24, 2007
Filing Date:
August 28, 2000
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
H01H11/00; H01H45/02; H01H49/00; H01H50/02; (IPC1-7): H01H11/00; H01H45/02; H01H49/00; H01H50/02
Domestic Patent References:
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| JP9320411A | ||||
| JP54080543A | ||||
| JP2000015454A | ||||
| JP59076689A | ||||
| JP4332417A | ||||
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Attorney, Agent or Firm:
Takehiko Matsumoto
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