Title:
接着剤層付き半導体チップの製造方法
Document Type and Number:
Japanese Patent JP4664005
Kind Code:
B2
Inventors:
Akinori Sato
Osamu Yamazaki
Takashi Sugino
Osamu Yamazaki
Takashi Sugino
Application Number:
JP2004141412A
Publication Date:
April 06, 2011
Filing Date:
May 11, 2004
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J4/00; H01L21/301; C09J131/04; C09J133/00; C09J201/02; H01L21/02; H01L21/52
Domestic Patent References:
| JP8027239A | ||||
| JP2003318205A | ||||
| JP2002118081A | ||||
| JP2003142505A | ||||
| JP2003105292A | ||||
| JP2002256237A |
Attorney, Agent or Firm:
Tamotsu Otani