MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND MANUFACTURING APPARATUS

Japanese Patent JP2004023014

A

To stabilize the quality of deposition by preventing the temperature drop of a plating solution, while realizing efficient utilization of the plating solution.

A production device has a warm-water bath 12, in which warm water Wa heated to a prescribed temperature is stored, a plating tank 13, in which a plating solution M is stored, and a piping 14 for a circulation for making the plating solution M circulate in the plating tank 13. The plating tank 13 and the piping 14 for the circulation are disposed in the warm water Wa heated to the prescribed temperature, and the inside of the plating tank 13 is supplied with the plating solution M heated by the circulation in the piping 14 for the circulation.

JP2003313669	ELECTROLESS PLATING PROCESS AND SEMICONDUCTOR WAFER WHEREIN METAL PLATING LAYER IS FORMED THROUGH THE PROCESS
JPH1058594	MANUFACTURE OF METAL-COATED FILM IN WEB FORM
JP2005105409	METHOD FOR MANUFACTURING POROUS SILICON STRUCTURE AND METHOD FOR MANUFACTURING METAL-CARRYING POROUS SILICON

SEGAWA YUJI
SATO SHUZO
ISHIHARA SHIGEO
YASUDA YOSHIYA
NOGAMI TAKESHI

JP2002179394A

January 22, 2004

June 20, 2002

Click for automatic bibliography generation  

SONY CORP

C23C18/16; C23C18/31; H01L21/288; (IPC1-7): H01L21/288; C23C18/16; C23C18/31

Masaru Sato

Previous Patent: TAP CHANGER FOR TRANSFORMER

Next Patent: MAGNETORESISTIVE EFFECT ELEMENT AND METHOD OF MANUFACTURING THE SAME, AND MAGNETIC MEMORY DEVICE