To improve manufacturing efficiency by inspecting characteristics under a state where a batch sealing is formed.

A semiconductor chip 4 is bonded and fixed to a multi-piece substrate 8, and an electrode 4a of the semiconductor chip 4 is bonded to a bonding electrode 2b of the multi-piece substrate 8 with a bonding wire 6, and a batch mold part 9 is formed with a sealing resin 7. In this state using a probe card P, a sensing pin N is made to contact the connecting electrode 2a of the multi-piece substrate 8 to inspect electric characteristics. Each grade showing the inspected result is marked at the batch mold 9 for each device region 8a. A solder bump is formed on the rear surface of the multi-piece substrate 8 for making the batch mold 9 into individual pieces, and a marked sign showing the grade is identified by image identifying, etc., and then the pieces are stored in trays divided for each grade.