MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Title:

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2005033053

Kind Code:

A

Abstract:

To provide a manufacturing method of a semiconductor device capable of efficiently manufacturing a highly reliable flip chip system semiconductor device excellent in heat resistance and moisture resistance, and to provide the semiconductor device manufactured by the method.

In the manufacturing method of the semiconductor device for mounting a semiconductor element by a flip chip system, after joining the semiconductor element to a circuit board by using a thermosetting resin, a photosetting resin is applied to the peripheral part of the semiconductor element, it is photoset and a filet is formed. Also, in the semiconductor device for which the semiconductor element is mounted on the circuit board by the flip chip system, the semiconductor element is joined to the circuit board by the thermosetting resin at a part right below it and the filet is formed by the photosetting resin at the peripheral part.

Inventors:

NAKADA YASUKAZU
YAMAKAGE MASATERU
HASEGAWA NAOKI

Application Number:

JP2003271844A

Publication Date:

February 03, 2005

Filing Date:

July 08, 2003

Export Citation:

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Assignee:

LINTEC CORP

International Classes:

G03B21/10; G02B27/18; G03B21/14; H01L21/56; H01L21/60; H01L23/12; H01L23/29; (IPC1-7): H01L21/60

Attorney, Agent or Firm:

Mitsuru Uchiyama

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