To remove components of an atmosphere deposited on a substrate.

When the substrate is carried into a load lock chamber, the load lock chamber is evacuated and then purge gas is introduced into the chamber to raise a pressure. Subsequently, the load lock chamber is evacuated again. Thus components of the atmosphere deposited on the substrate are removed. Thereafter, the substrate is carried into a processing chamber from the load lock chamber and is processed in the processing chamber. A process of processing the substrate is, for example, a process of forming a film on the substrate using gas reacting with components included in the atmosphere.