Title:
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP2016132051
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of detecting or predicting in real time, scratch or crack during grinding; and to provide a semiconductor manufacturing device.SOLUTION: A manufacturing method of a semiconductor device in an embodiment has steps of: detecting an elastic wave generated from a workpiece during grinding of the workpiece; and detecting or predicting an abnormality of the workpiece generated during grinding by analyzing the detected elastic wave.SELECTED DRAWING: Figure 1
Inventors:
MATSUI YUKITERU
KAWASAKI TAKAHIKO
KAWASE AKIFUMI
SUZUKI SHUJI
MIKI TSUTOMU
KAWASAKI TAKAHIKO
KAWASE AKIFUMI
SUZUKI SHUJI
MIKI TSUTOMU
Application Number:
JP2015007017A
Publication Date:
July 25, 2016
Filing Date:
January 16, 2015
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B24B49/04; B24B37/30; B24B49/10; H01L21/304
Domestic Patent References:
| JP2002160154A | 2002-06-04 | |||
| JP2012192511A | 2012-10-11 | |||
| JPH11183447A | 1999-07-09 | |||
| JP2003037090A | 2003-02-07 |
Foreign References:
| US20070061088A1 | 2007-03-15 |
Attorney, Agent or Firm:
Hirohito Katsunuma
Takeshi Sekine
Akaoka Akira
Hakozaki Yukio
Takeshi Sekine
Akaoka Akira
Hakozaki Yukio