Title:
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023151168
Kind Code:
A
Abstract:
To provide a manufacturing method of a semiconductor device, capable of suppressing a cut dust generated at the time of cutting of an adhesive tape for a semiconductor processing.SOLUTION: A method includes in this order, following steps S1, S2. The step S1 is: a step for sticking an adhesive tape for semiconductor processing to a surface of a semiconductor wafer which has, front and rear surfaces on which a circuit is formed, then, cutting the adhesive tape for semiconductor processing by a blade along a contour of the semiconductor wafer, then removing a non-sticking part which is not stuck to the semiconductor wafer on the adhesive tape for semiconductor processing, the step S2 is: a step for grinding a rear surface of the semiconductor wafer. In addition, in the step S1, in a vertical direction to a horizontal surface of the adhesive tape for semiconductor processing stuck to the semiconductor wafer, a sticking surface side with the semiconductor wafer of the adhesive tape for semiconductor processing is a lower direction, and an opposite side is an upper direction, and in this state, a cut edge of the non-sticking part is warped in the upper direction, by advance of the blade.SELECTED DRAWING: Figure 1
Inventors:
KANEKO SATOSHI
TORIGOE SHOTO
TORIGOE SHOTO
Application Number:
JP2022060627A
Publication Date:
October 16, 2023
Filing Date:
March 31, 2022
Export Citation:
Assignee:
LINTEC CORP
International Classes:
H01L21/301; B24B7/22; B24B27/06; B24B41/06; B26D3/00; B26D3/10; B28D5/00; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office
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