MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - 株式会社日立製作所

Title:

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP3207844

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To settle the problem where a resin is not effectively used while the pressure in a mold flow path is not constant with a conventional technology.
SOLUTION: A lead frame where a plurality of tabs on which a semiconductor element is placed are arrayed in both vertical and horizontal directions is placed on a mold comprising, for example, a plurality of pots for supplying, under pressure, a mold resin, a communication path between pots, and a plurality of cavities provided in series. The pot is fed with a resin, which is pressurized with a plurality of plungers so that the resin is injected into the cavity in the mold. Thus, both productivity and quality of a resin-mold semiconductor are significantly improved.

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Inventors:

Junichi Saeki
Kaneda Aizo
Shigeharu Tsunoda
Isamu Yoshida
Kunihiko Nishi

Application Number:

JP2000255360A

Publication Date:

September 10, 2001

Filing Date:

April 25, 1988

Export Citation:

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Assignee:

株式会社日立製作所

International Classes:

B29C45/02; B29C45/77; H01L21/56; H01L23/50; (IPC1-7): H01L21/56; B29C45/02; B29C45/77

Domestic Patent References:

JP6278836A

Attorney, Agent or Firm:

Yoshiaki Numagata (1 person outside)

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