Title:
半導体素子の作製方法
Document Type and Number:
Japanese Patent JP4889933
Kind Code:
B2
Inventors:
Genki Fujii
Shinji Maekawa
Shinji Maekawa
Application Number:
JP2004285912A
Publication Date:
March 07, 2012
Filing Date:
September 30, 2004
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
G02F1/1343; H01L21/768; G02F1/1345; G02F1/1368; H01L21/027; H01L21/28; H01L21/288; H01L21/336; H01L29/423; H01L29/49; H01L29/786
Domestic Patent References:
| JP2003098548A | ||||
| JP10112499A | ||||
| JP11186274A | ||||
| JP7122638A |
Foreign References:
| WO1997043689A1 |