Title:
Manufacturing method of semiconductor device
Document Type and Number:
Japanese Patent JP6040974
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device having an insulation resin layer as the semiconductor device and capable of exhibiting sufficient reliability and connection reliability.SOLUTION: A semiconductor device comprises: a first substrate having a first terminal; a second substrate having a second terminal; and a junction part bonding the first terminal and the second terminal, and the insulation resin layer is formed from the resin composition containing at least of filler and the filler derived from the resin composition, is included in the junction part.SELECTED DRAWING: Figure 2
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Inventors:
Satoshi Katsura
Kensuke Nakamura
Kensuke Nakamura
Application Number:
JP2014210134A
Publication Date:
December 07, 2016
Filing Date:
October 14, 2014
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP2008091650A | ||||
| JP2011036901A | ||||
| JP2000332056A | ||||
| JP2005175337A |
Foreign References:
| WO2007099866A1 | ||||
| WO2010052871A1 |
Attorney, Agent or Firm:
Shinji Hayami