Title:
Manufacturing method of semiconductor device
Document Type and Number:
Japanese Patent JP6104523
Kind Code:
B2
Inventors:
Dai Hisamoto
Naoki Tega
Kumiko Konishi
Hiroyuki Matsushima
Naoki Tega
Kumiko Konishi
Hiroyuki Matsushima
Application Number:
JP2012129460A
Publication Date:
March 29, 2017
Filing Date:
June 07, 2012
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L29/78; H01L21/28; H01L21/336; H01L29/12; H01L29/417
Domestic Patent References:
| JP2083982A | ||||
| JP2005101588A | ||||
| JP2010225615A | ||||
| JP1152671A | ||||
| JP2281661A | ||||
| JP2003158259A |
Foreign References:
| WO2011061918A1 |
Attorney, Agent or Firm:
Yamato Tsutsui
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