Title:
Manufacturing method of semiconductor device
Document Type and Number:
Japanese Patent JP6199724
Kind Code:
B2
Abstract:
In a manufacturing method of a semiconductor device according to an embodiment, a plurality of semiconductor packages each including a semiconductor chip mounted on a wiring board and a sealing resin layer as objects to be processed, and a tray including a plurality of housing parts are prepared. A depressed portion having a non-penetrating shape or a penetrating shape is formed in the housing part. The semiconductor packages are disposed in the plural housing parts respectively. By sputtering a metal material on the semiconductor package housed in the tray, a conductive shield layer is formed.
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Inventors:
Yoshiaki Goto
Takashi Imoto
Takeshi Watanabe
Yuu Takano
Yusuke Akada
Karin Yuji
Yoshinori Okayama
Akihiko Yanagida
Takashi Imoto
Takeshi Watanabe
Yuu Takano
Yusuke Akada
Karin Yuji
Yoshinori Okayama
Akihiko Yanagida
Application Number:
JP2013258705A
Publication Date:
September 20, 2017
Filing Date:
December 13, 2013
Export Citation:
Assignee:
Toshiba Memory Corporation
International Classes:
H01L23/00; H01L23/28
Domestic Patent References:
| JP2010212410A | ||||
| JP2012074669A | ||||
| JP2009179354A | ||||
| JP2002002871A | ||||
| JP2009290217A | ||||
| JP2005014937A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office