Title:
Manufacturing method of semiconductor devices
Document Type and Number:
Japanese Patent JP6324743
Kind Code:
B2
Abstract:
A method for manufacturing a semiconductor device that includes steps of: (1) adhering a support substrate to a first surface of a wafer using an adhesive, the wafer including first and second scribe lines extending along first and second directions, respectively, (2) thinning the wafer, (3) forming a groove in a first scribe line excluding a region located in an outer peripheral portion of the wafer, the groove piercing the wafer from the first surface to a second surface opposite to the first surface to expose the adhesive, the first scribe line and the second scribe line demarcating chip regions; and (4) removing the adhesive by immersing the wafer adhered to the support substrate in a solvent such that the solvent permeates into the groove.
Inventors:
Toshiyuki Kawasaka
Hiroshi Kawakubo
Hiroshi Kawakubo
Application Number:
JP2014016990A
Publication Date:
May 16, 2018
Filing Date:
January 31, 2014
Export Citation:
Assignee:
Sumitomo Electric Device Innovation Co., Ltd.
International Classes:
H01L21/301; B23K26/00; B23K26/364; H01L21/304
Domestic Patent References:
| JP1225510A | ||||
| JP2003338475A | ||||
| JP2004146487A | ||||
| JP9001542A | ||||
| JP11026403A | ||||
| JP2006187973A | ||||
| JP2012517111A |
Attorney, Agent or Firm:
Shuhei Katayama