Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7062716
Kind Code:
B2
Abstract:
A method of manufacturing a semiconductor device by using an exposure apparatus having a reticle stage and a projection optical system includes a first period in which substrates are exposed by using a first reticle arranged on the reticle stage, a second period in which substrates are exposed by using a second reticle arranged on the reticle stage, and a third period which is between the first and second periods. The method includes changing, in at least part of the third period, the first reticle arranged on the reticle stage to the second reticle, and performing control, in the first and second periods, to adjust temperature distribution of an optical element of the projection optical system so as to reduce change in aberration of the projection optical system. The third period is shorter than the first period.
Inventors:
Takehiro Toyota
Hiroaki Kobayashi
Hideki Ina
Kosuke Asano
Aki Miyano
Hiroaki Kobayashi
Hideki Ina
Kosuke Asano
Aki Miyano
Application Number:
JP2020058312A
Publication Date:
May 06, 2022
Filing Date:
March 27, 2020
Export Citation:
Assignee:
Canon Inc
International Classes:
G03F7/20
Domestic Patent References:
| JP10050585A | ||||
| JP2005044883A | ||||
| JP2009302154A | ||||
| JP2005019628A | ||||
| JP2011048126A | ||||
| JP2019109308A | ||||
| JP2006073584A |
Attorney, Agent or Firm:
Patent Business Corporation Otsuka International Patent Office