Title:
半導体装置の製造方法及び支持テープ
Document Type and Number:
Japanese Patent JP4619308
Kind Code:
B2
Inventors:
Akira Suzuki
Takahiro Oikawa
Kameyama Kojiro
Takahiro Oikawa
Kameyama Kojiro
Application Number:
JP2006061711A
Publication Date:
January 26, 2011
Filing Date:
March 07, 2006
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
Sanyo Semiconductor Manufacturing Co., Ltd.
Sanyo Semiconductor Manufacturing Co., Ltd.
International Classes:
H01L21/683; H01L21/304; H01L21/3205; H01L23/12; H01L23/52
Domestic Patent References:
| JP2003309221A | ||||
| JP2007180395A | ||||
| JP10270537A | ||||
| JP2003068679A | ||||
| JP2004296935A | ||||
| JP2005191550A | ||||
| JP2001185519A | ||||
| JP2004186200A |
Attorney, Agent or Firm:
Katsuhiko Sudo