Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3597122
Kind Code:
B2
Inventors:
Hirofumi Katayama
Takashi Ueda
Takashi Ueda
Application Number:
JP2000278177A
Publication Date:
December 02, 2004
Filing Date:
September 13, 2000
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/283; H01L21/336; H01L29/78; (IPC1-7): H01L29/78; H01L21/283; H01L21/336
Domestic Patent References:
| JP4249358A | ||||
| JP49039381A | ||||
| JP2001284345A | ||||
| JP58093331A | ||||
| JP3104236A | ||||
| JP11026757A |
Attorney, Agent or Firm:
Shintaro Nogawa