Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3994498
Kind Code:
B2
Inventors:
Shinjiro Fujii
Maekawa Iwao
Osamu Suwa
Maekawa Iwao
Osamu Suwa
Application Number:
JP1918298A
Publication Date:
October 17, 2007
Filing Date:
January 30, 1998
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J7/00; H01L21/52; C09J179/08; H01L21/301; H01L21/58; H01L21/68
Domestic Patent References:
| JP3046242A | ||||
| JP6302629A | ||||
| JP9017810A | ||||
| JP7307352A | ||||
| JP59221369A |
Attorney, Agent or Firm:
Hidekazu Miyoshi