Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4056417
Kind Code:
B2
Inventors:
Daisuke Nagao
Tomonori Saeki
Tomonori Saeki
Application Number:
JP2003087911A
Publication Date:
March 05, 2008
Filing Date:
March 27, 2003
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/304; H01L21/308
Domestic Patent References:
| JP3129732A | ||||
| JP2001332526A |
Attorney, Agent or Firm:
Shoyo domestic and overseas patent office