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Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4127064
Kind Code:
B2
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Inventors:
Setsuko Wakimoto
Hiroyuki Tanaka
Application Number:
JP2003019286A
Publication Date:
July 30, 2008
Filing Date:
January 28, 2003
Export Citation:
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Assignee:
Fuji Electric Device Technology Co., Ltd.
International Classes:
H01L21/3065; H01L21/336; H01L29/739; H01L29/78
Domestic Patent References:
JP6140501A
JP55111134A
JP63088827A
JP2002343739A
JP3029322A
JP2002025986A
JP2002531946A
Attorney, Agent or Firm:
Akinori Sakai



 
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