Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4225183
Kind Code:
B2
Abstract:
To uniformly form solvent content resin on a semiconductor device in a manufacturing method of the device, with which substantially the device is molded with molded resin, after solvent content resin has been applied to the device where a pair of heatsinks are arranged on both faces of a semiconductor chip.
A method includes processes, wherein solvent content resin is dried by heating the device 100 by using a thermostatic oven and a drier to eliminate a temperature slope between a pair of heatsinks 20 and 30, after a process of applying a solvent content resin prior to the process of performing molding by molded resin 60.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Naohiko Hirano
Shinsuke Nagasaka
Shinsuke Nagasaka
Application Number:
JP2003375319A
Publication Date:
February 18, 2009
Filing Date:
November 05, 2003
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/29; H01L21/56; H01L23/31
Domestic Patent References:
| JP61125022A | ||||
| JP2308557A | ||||
| JP8259894A | ||||
| JP10189857A | ||||
| JP2002324816A | ||||
| JP2003124406A |
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno
Takahiro Miura
Fumihiro Mizuno