Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4404737
Kind Code:
B2
Inventors:
Nakamura Makiko
Application Number:
JP2004285825A
Publication Date:
January 27, 2010
Filing Date:
September 30, 2004
Export Citation:
Assignee:
oki Semiconductor Co., Ltd.
International Classes:
H01L21/3213; H01L21/302; H01L21/308; H01L21/3205; H01L23/52
Domestic Patent References:
| JP5343398A | ||||
| JP7058084A | ||||
| JP8321507A | ||||
| JP11111719A | ||||
| JP8250462A | ||||
| JP4079327A | ||||
| JP4257239A | ||||
| JP2000340570A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda