Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4535754
Kind Code:
B2
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Inventors:
Nobuyuki Motohashi
Application Number:
JP2004086485A
Publication Date:
September 01, 2010
Filing Date:
March 24, 2004
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
F27B5/04; H01L21/31; F27B5/16; F27D7/02; H01L21/22
Domestic Patent References:
| JP64022023A | ||||
| JP59146940U | ||||
| JP58032640U | ||||
| JP7201760A |
Attorney, Agent or Firm:
Hiroshi Kakutani