Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5112487
Kind Code:
B2
Abstract:
To obtain a semiconductor device using a UV curable resin material to which satisfactory pattern transfer is performed.
The semiconductor device is manufactured by using the UV curable resin material for pattern transfer containing at least one of 2-methyl-2-adamantyl acrylate, 2-ethyl-2-adamantyl acrylate and 1,3-adamantane dimethanol diacrylate, and isobornyl acrylate, a multifunctional acrylate and a polymerization initiator, or at least one of the acrylates, a polymerization initiator and a fluorine-based alcohol.
COPYRIGHT: (C)2011,JPO&INPIT
Inventors:
Masakazu Morita
Umezawa Kazuyo
Masatoshi Sakurai
Umezawa Kazuyo
Masatoshi Sakurai
Application Number:
JP2010207046A
Publication Date:
January 09, 2013
Filing Date:
September 15, 2010
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
G11B5/84; B29C59/02; C08F2/00; H01L21/027; B29L17/00
Domestic Patent References:
| JP2010159369A | ||||
| JP2009051017A | ||||
| JP2007204736A | ||||
| JP7324170A | ||||
| JP2010206189A |
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen