Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5428121
Kind Code:
B2
Inventors:
Teruo Takizawa
Hirokazu Hisamatsu
Hirokazu Hisamatsu
Application Number:
JP2005288879A
Publication Date:
February 26, 2014
Filing Date:
September 30, 2005
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L21/336; H01L21/265; H01L21/76; H01L21/762; H01L27/12; H01L29/786
Domestic Patent References:
| JP2002231957A | ||||
| JP4137730A | ||||
| JP2004289152A | ||||
| JP10242468A | ||||
| JP11502675A |
Foreign References:
| WO1997048136A1 |
Attorney, Agent or Firm:
Tetsuya Mori