Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6385532
Kind Code:
B2
Inventors:
Ogata complete
Toshifumi Iwasaki
Toshifumi Iwasaki
Application Number:
JP2017137697A
Publication Date:
September 05, 2018
Filing Date:
July 14, 2017
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/8234; H01L21/336; H01L27/088; H01L29/78
Domestic Patent References:
| JP2000236090A | ||||
| JP2002368008A | ||||
| JP2001332630A | ||||
| JP2003151991A | ||||
| JP2005277172A | ||||
| JP2009130009A | ||||
| JP2007067048A | ||||
| JP2007012824A |
Attorney, Agent or Firm:
Yamato Tsutsui
Atsushi Sugada
Akiko Tsutsui
Tetsuya Sakaji
Atsushi Sugada
Akiko Tsutsui
Tetsuya Sakaji