Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6410152
Kind Code:
B2
Inventors:
Takashi Shirano
Mika Fujii
Wako Higashi
Mika Fujii
Wako Higashi
Application Number:
JP2015180152A
Publication Date:
October 24, 2018
Filing Date:
September 11, 2015
Export Citation:
Assignee:
Toshiba Memory Corporation
International Classes:
H01L21/304; B23K26/53; B24B7/22; B24B9/00
Domestic Patent References:
| JP2009283802A | ||||
| JP2005026413A | ||||
| JP2009131942A |
Foreign References:
| US20140051233 |
Attorney, Agent or Firm:
Sakai International Patent Office
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