Title:
半導体素子の製造方法
Document Type and Number:
Japanese Patent JP4590880
Kind Code:
B2
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Inventors:
Haruo Nakazawa
Kazuo Shimoyama
Mitsuaki Kirizawa
Kazuo Shimoyama
Mitsuaki Kirizawa
Application Number:
JP2004036547A
Publication Date:
December 01, 2010
Filing Date:
February 13, 2004
Export Citation:
Assignee:
Fuji Electric Systems Co., Ltd.
International Classes:
H01L21/20; H01L21/265; H01L21/336; H01L29/739; H01L29/78
Domestic Patent References:
JP2003059856A | ||||
JP2002329864A | ||||
JP2001044120A | ||||
JP2002139697A | ||||
JP2002141301A | ||||
JP2001057345A | ||||
JP55111128A | ||||
JP9063974A |
Attorney, Agent or Firm:
Takeshi Hattori