Title:
半導体発光装置、照明モジュール、照明装置、表示素子、および半導体発光装置の製造方法
Document Type and Number:
Japanese Patent JP2007517378
Kind Code:
A
Abstract:
In an LED array chip (2), LEDs (6) are connected together in series by a bridging wire (30). The LEDs (6) each have a semiconductor multilayer structure (8-18) including a light emitting layer (14). Here, the semiconductor multilayer structure (8-18) is epitaxially grown on a front surface of an SiC substrate (4). A phosphor film (48) covers the LEDs (6). Two power supply terminals (36 and 38), which are electrically independent from each other, are formed on a back surface of the SiC substrate (4). The power supply terminal (36) is connected to a cathode electrode (32) of an LED (6a) at a lower potential end by a bridging wire (40) and a plated-through hole (42). The power supply terminal (38) is connected to an anode electrode (34) of an LED (6d) at a higher potential end by a bridging wire (44) and a plated-through hole (46).
Inventors:
Hideo Nagai
Application Number:
JP2006520499A
Publication Date:
June 28, 2007
Filing Date:
December 17, 2004
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L33/06; F21K99/00; F21S2/00; H01L25/075; H01L33/08; H01L33/10; H01L33/32; H01L33/34; H01L33/38; H01L33/42; H01L33/50; H01L33/56; H01L33/58; H01L33/60
Attorney, Agent or Firm:
Shiro Nakajima
Shuji Matsumura
Kobayashi Kunito
Shuji Matsumura
Kobayashi Kunito