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Title:
半導体センサの製造方法
Document Type and Number:
Japanese Patent JP4736307
Kind Code:
B2
Abstract:

To provide a semiconductor sensor capable of manufacturing a resistor more appropriately as a semiconductor having a substantially uniform carrier concentration, and to provide its manufacturing method.

An SOI (silicon on insulator) substrate where a silicon oxide film 20 and a single crystal silicon film 30 are deposited on a semiconductor substrate 10 is prepared (Fig. (a)). In the steps shown on Fig. (b)-Fig.(d), ions are implanted in the single crystal silicon film 30 with implantation energy quantities of "30 keV", "100 keV" and "170 keV". Upon ending three times of ion implantation, impurities are diffused in the single crystal silicon film 30 and activated by heat treatment. Impurity concentration is made substantially uniform from the upper surface to the lower surface of the single crystal silicon film 30 through that heat treatment.

COPYRIGHT: (C)2004,JPO&NCIPI


Inventors:
Takao Iwaki
Hiroyuki Wado
Toshimasa Yamamoto
Application Number:
JP2003020410A
Publication Date:
July 27, 2011
Filing Date:
January 29, 2003
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
G01F1/692; H01L21/265; H01L21/822; H01L27/04; H01L37/00
Domestic Patent References:
JP2001249040A
JP2001215141A
JP5291298A
JP2000002571A
JP62026867A
JP3208375A
Other References:
UCS半導体基盤技術研究会,シリコンの科学,1996年 6月28日,pp. 1018
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda



 
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