Title:
電子デバイス用半導体基板の製造方法
Document Type and Number:
Japanese Patent JP5041397
Kind Code:
B2
Inventors:
Naoki Shibata
Koji Hirata
Shiro Yamasaki
Katsuhiro Imai
Makoto Iwai
Takatomo Sasaki
Yusuke Mori
Kawamura Shiro
Koji Hirata
Shiro Yamasaki
Katsuhiro Imai
Makoto Iwai
Takatomo Sasaki
Yusuke Mori
Kawamura Shiro
Application Number:
JP2006122400A
Publication Date:
October 03, 2012
Filing Date:
April 26, 2006
Export Citation:
Assignee:
Toyoda Gosei Co., Ltd.
Nippon Insulator Co., Ltd.
National University Corporation Osaka University
Nippon Insulator Co., Ltd.
National University Corporation Osaka University
International Classes:
C30B29/38; C30B19/12; H01L21/208; H01L21/338; H01L29/778; H01L29/812
Domestic Patent References:
| JP2007246341A | ||||
| JP2004363346A |
Foreign References:
| WO2004083498A1 |
Attorney, Agent or Firm:
Osamu Fujitani