Title:
炭化珪素半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5052169
Kind Code:
B2
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Inventors:
Koichi Nishikawa
Shinji Guri
Shinji Guri
Application Number:
JP2007065937A
Publication Date:
October 17, 2012
Filing Date:
March 15, 2007
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L21/28; H01L21/329; H01L29/47; H01L29/872
Domestic Patent References:
| JP2006073923A | ||||
| JP2003077860A |