Title:
基板処理装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5466670
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a processing chamber configured to process a substrate, a substrate support member provided within the processing chamber to support the substrate, a microwave generator provided outside the processing chamber, a waveguide launch port configured to supply a microwave generated by the microwave generator into the processing chamber, wherein the central position of the waveguide launch port is deviated from the central position of the substrate supported on the substrate support member and the waveguide launch port faces a portion of a front surface of the substrate supported on the substrate support member, and a control unit configured to change a relative position of the substrate support member in a horizontal direction with respect to the waveguide launch port.
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Inventors:
Tokunobu Akao
Ogawa Unryu
Okuno Masahisa
Shinji Yashima
Junji Umekawa
Kaichiro Minami
Ogawa Unryu
Okuno Masahisa
Shinji Yashima
Junji Umekawa
Kaichiro Minami
Application Number:
JP2011140105A
Publication Date:
April 09, 2014
Filing Date:
June 24, 2011
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/31; C23C16/46; H01L21/268; H01L21/683
Domestic Patent References:
| JP63027022A | ||||
| JP3036274A | ||||
| JP2003059919A | ||||
| JP2002289521A | ||||
| JP2006140386A | ||||
| JP2010225760A |
Foreign References:
| WO2009122913A1 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation