Title:
基板支持具、基板処理装置、及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6753881
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a structure which can reduce the influence on a processing result while retaining the strength of a substrate support tool.SOLUTION: A substrate support tool is arranged to support a plurality of substrates horizontally in a state where the plurality of substrates are spaced apart from each other vertically. The substrate support tool comprises: main support poles 1 provided with substrate holding parts for supporting the plurality of substrates; and auxiliary support poles 2 having a diameter larger than a diameter of the main support poles and smaller than a length of the substrate holding parts, provided so that the distance thereof from an edge of the substrate is smaller than a distance between the substrate edge and a main support pole surface arising between adjacent substrate holding parts provided on the main support pole, and arranged so as not to touch the substrate.SELECTED DRAWING: Figure 7
Inventors:
Kazuki Nonomura
Hirohisa Yamazaki
Hirohisa Yamazaki
Application Number:
JP2018036095A
Publication Date:
September 09, 2020
Filing Date:
March 01, 2018
Export Citation:
Assignee:
Kokusai electric inc.
International Classes:
H01L21/31; C23C16/458; H01L21/316; H01L21/683
Domestic Patent References:
| JP2000100739A | ||||
| JP5066967U | ||||
| JP2009272386A | ||||
| JP2012004246A | ||||
| JP2006165134A |
Foreign References:
| US20080185308 |