To provide a manufacturing method of a substrate by which the substrate is less likely to be broken or cracked.
The manufacturing method of a substrate includes: a step for preparing a block having a first surface and a second surface provided on a back side of the first surface and fixed by a holding member; and a cutting step for cutting the block by a wire from the first surface to the second surface, while performing travel of the wire alternately in a first direction and a second direction along a longitudinal direction of the wire. The cutting step includes: an initial step for making the wire in contact with the block from a first surface side, and cutting, by the wire, a first area on the first surface side in the block; a middle step for cutting, by the wire, a middle area located between the first area and a second area on a second surface side in the block; and a final step for cutting the second area in the block by the wire. Control is performed so that the distance where the wire travels continuously in one direction, in at least one of the initial step and the final step, is longer than the distance where the wire travels continuously in one direction in the middle step.
HAYAKAWA TOMOHIRO
JPH0966522A | 1997-03-11 | |||
JPS63169260A | 1988-07-13 | |||
JP2010105061A | 2010-05-13 | |||
JP2005186222A | 2005-07-14 | |||
JPH1086141A | 1998-04-07 | |||
JPH10175153A | 1998-06-30 | |||
JPH0966522A | 1997-03-11 | |||
JPS63169260A | 1988-07-13 | |||
JP2010105061A | 2010-05-13 |
US20060107940A1 | 2006-05-25 | |||
US20060107940A1 | 2006-05-25 |
Takahiro Arita
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